Freescale Semiconductor, Inc

About Freescale Semiconductor Freescale Semiconductor, Inc. is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. The privately held company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale is one of the world's largest semiconductor companies with 2006 sales of $6.4 billion (USD). http://www.freescale.com About Freescale Semiconductor Malaysia Freescale Semiconductor Sdn Bhd (012631-D), formerly known as Motorola Malaysia Sdn Bhd, is part of Freescale Semiconductor Inc. Our semiconductor facility in Sg Way Petaling Jaya is one of the largest and most sophisticated in the world. This 20-acre state-of-the-art facility has a total manufacturing floor space of 260,000 sq. ft. The advanced semiconductor products we manufacture, assemble, test and ship directly to customers worldwide include RF components, microcontrollers, microprocessors, Digital Signal Processors (DSP), and Fast Static RAMs (FS-RAMs) to support the Networking and Computing and Transportion market segments. We believe in a set of philosophies that inculcate an uncompromising attitude towards Quality, Technology Excellence and Total Customer Satisfaction to constantly be on guard of the challenges and changes in the industry. If you are a team player seeking to accelerate your career in a global company, we would be interested in meeting with you to help you drive your next career move to greater heights. Process Engineer (EOL) (Selangor - Petaling Jaya) The candidate will be responsible for process characterization and process windowing of New product/package qualification and/or new materials qualification. Expectations from the candidate includes delivering stable and capable process for high volume manufacturing by working closely with factory NPI teams and external final manufacturing sites. The candidate must be a subject matter expertise in the respective process and expected to be creative, innovative and “hands on” to resolve critical package engineering issues and provide technical resolutions related to assembly material and processes. Expectations from the candidate includes Ensuring reliable, design for manufacturability products launch Liasing and work closely with NTI/NPI core team members, involving various department MBGs, PSD, Operation and QA to ensure smooth transfer and ramp Link with factory-based engineering teams to support package and/or assembly materials and process continuous improvement. Provide technical issue resolutions for major customers or manufacturing issues related to package system designs Flexibility on traveling is required to support ad hoc customer issues Minimum 3 ~ 5years working experiences in semiconductor assembly packaging. Experiences in backend assembly packaging processes (ie ball attach, flux clean, laser mark, vision inspection etc) will be an added advantage Must be independent, mature and able to work well in teams and result oriented. Experience in assembly of Flipchip, BGA, QFPs and MEMS sensors products will be an added advantage We encourage qualified candidates to apply via on-line, email or web site at http://www.freescale.com/careers